15th International Symposium on the Physical
and Failure Analysis of Integrated Circuits (IPFA)

Grand Copthorne Waterfront Hotel, Singapore
07-11 July, 2008

MultiProbe will be an exhibitor and Tea Break Sponsor at the 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2008). The conference is organized by the IEEE Reliability/CPMT/ED Singapore Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

IPFA 2008 serves to provide "fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies." IPFA 2008 follows the conference's tradition of presenting enhanced physical and failure analysis, and exhibiting reliability equipment and services.