NonContact Imaging and Probing

	Copper lines at metal: 90nm (left) Non-contact imaging is ideal for imaging challenging topography without smearing or damaging samples. SRAM at contact level : 65nm (right) As the the geometry of devices decrease, so will the material choice for the contact level. Non-Contact Imaging provides an accurate image, regardless of topography or materials.
	Features and Benefits

Overview

Non-contact imaging is the only method that can meet new challenges brought about by advancements in microelectronic design

As microelectronics companies are striving for ever increasing speed in their technologies, modern chip designs are requiring more conductive metals. Some of the softer metals used, such as “Unobtanium alloys of copper”, make routine contact imaging difficult without damaging the sample. Non-Contact imaging is the answer to measuring these soft metals while maintaining the integrity of the device. The Non-Contact imaging mode allows the AFP Nanoprober to image fragile structures like nano-wires and soft metals, and also high-profile samples with varied degrees of topography.

Features

Non-contact imaging works by oscillating the probe tip over the sample and monitoring amplitude changes. A digital feedback loop maintains a constant oscillation amplitude by moving the tip in Z, hence, measuring the height of the sample.

In contrast, typical contact-mode measures the vertical deflection of the imaging cantilever as it scans across the sample surface. During imaging, real-time cantilever deflection is measured with a laser. The normal component of the force exerted on the sample by the tip, is kept constant by varying the Z position of the lever. The result of this is a constant tip/sample force with the Z position of the lever, a direct measure of the sample topography. However, the lateral forces are not measured by this interaction. These lateral forces can result in significant damage to the sample, especially for the new soft metal materials.

By eliminating lateral forces and the possiblity for sample damage or image degradation, MultiProbe’s Non-Contact Imaging provides an accurate image ready for probing.

 

FEATURES	BENEFITS
Reduced Lateral Force	Time and cost savings: Prevents tip wear and sample damage
	Flexibility to image and probe softer metals such as “Unobtanium alloys of copper”
	Versatility to image and probe samples with greater degrees of topography